Discussion in 'OT Technology' started by dirteemac, Aug 14, 2006.
End of the year, sampling beginning of next.
In my opinion, processors will keep moving forward until we can no longer find ways to cool them affordably. Has anyone seen the person who overclocked his Pentium 4 to 5 GHZ, and then he cooled it with liquid nitrogen? I will have to get that video and post it here sometime.
Parallel is the new trend. 2 cores, 4, 8... higher?
someone was talking about 16 core chips in the next couple of years
There's no reason not to have as many cores as you have processes, as long as its economically feasible, right?
Actually, cooling is only one of the concerns. Another concern is the ever shrinking size of the fabrication process. As the size of the fabrication process shrinks you introduce a lot of problems, such as electrical current "jumping" logic gates and subsequently causing a 0 to become a 1.
About 10 years ago chips were made on a 500 nanometer fab and now we're down to 65nm. It was widely believed about 8-10 years ago that it was impossible to manufacture at that level, but new technologies were developed that made 65nm possible. They're using different chemicals and metals in the fabrication process that enable them to manufacture at that level and companies are working to be able to develop even lower (IBM showed off a sub-30nm fab process this year).
Well, its not just economics that come in. There are engineering and manufacturing limitations.
i'm wary of the inevitable trend of sticking more and more cores in consumer machines. plus, there's a tradeoff between having multiple cores vs multiple processors. rather than do a poor job of explaining it, here's the results of a quick google:
Why? Supercomputers have how many parallel processors? Those problems are solved. Parallel computing with threads is easy.
I'm talking about chip design, not systems design.
What exactly is the difficult engineering problem in slapping 32 cores on one chip besides space?
Well, as you alluded to space is the driver. If you wanted to put 32 cores on a single piece of silicon today, you'd have to make a physically massive chip and the larger the chip, the bigger the difficulty in getting the chip built correctly (similar to how bad pixels held back LCD size for a long time).
So, since such a physically massive chip is unrealistic, you counter that by shrinking the die. Its when you push the die size down that you run into the difficult engineering issues. You run into issues like voltage leakage that must be overcome.
you can stack the chips
I think you meant stack the cores.
But you don't... actually know anything about this, huh?
I'm not trained as an electrical engineer.
Hey, I was asking
But honestly, none of us are chip designers. I know some about chip design (very little) as I work at a semiconductor company. Stacking the cores would be a poor idea, mostly because of routing and heat issues. Making the die bigger is going to increase cost (less chips per wafer), so there is going to be a die shrink before we see 8 core chips, IMO.